21.1: Invited Paper: System‐Level Co‐simulation Combined with Full‐wave 3D Model and Circuit Elements for Electrostatic Discharge in Display Devices
نویسندگان
چکیده
Co‐simulation combined with Full‐wave 3D and circuit elements is used to investigate ESD effects on signal transferring of a simplified smart phone device. A square wave amplitude 1.8V applied an address line from CPU DDR cache. Both the frequency position at are simulated transferring. The simulation results indicate that event actually influences which may lead error data
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ژورنال
عنوان ژورنال: Sid's Digest Of Technical Papers
سال: 2021
ISSN: ['2154-6738', '2168-0159', '2154-6746', '0097-966X']
DOI: https://doi.org/10.1002/sdtp.14404